| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of and an apparatus for manufacturing semiconductor devices which enhance the manufacturing yield and also reduce the time required for dividing process. <P>SOLUTION: Regions that become the starting points for cleavage consisting of at least either a plurality of grooves 12-1, 12-2, 12-3, ... or through holes are formed on pelletizing lines or dicing lines along cleavage faces of a wafer 10 in which semiconductor elements are formed, and a liquid substance is poured into the regions that become the starting points for cleavage. An external factor that physically changes the liquid substance is applied to make the change, and by utilizing the change, the wafer 10 is cleaved to divide it into individual semiconductor chips 13-1, 13-2, 13-3, .... Since the wafer 10 can be cleaved collectively, without applying external forces, the dividing method enhances the manufacturing yield and reduces the time required for the dividing process. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
