| 摘要 |
PROBLEM TO BE SOLVED: To indirectly measure amount of warpage which will be generated in a thinned semiconductor wafer, without actualling having to give thinning processing to the semiconductor wafer. SOLUTION: A pressure sensitive adhesive sheet T is pasted via a sticking roller 30, on a sheet-like object D of a work for adjustment of pressure sensitive adhesive sheet pasting equipment, wherein the sheet-like object D which has the same shape with a wafer shape is fixed temporarily on a dummy substrate W1 so that the object D can be exfoliated. The sheet-like object D, on which the pressure sensitive adhesive sheet T is pasted, is exfoliated from the dummy substrate W1, and amount of warpage of the object D is measured. COPYRIGHT: (C)2005,JPO&NCIPI
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