发明名称 CONDUCTIVE SILVER PASTE
摘要 PROBLEM TO BE SOLVED: To provide a conductive silver paste which does not contain silver oxide powder deteriorating a thermosetting epoxy resin or hampering its hardening, which can print well a fine pattern such as a fine pitch circuit without generating various abnormalities in printing but with good reproducibility, and which can form conductive wiring etc. which has higher conductivity than before. SOLUTION: In this conductive silver paste containing a thermosetting epoxy resin, scaly silver powder with an average grain size of 0.5-50μm and spherical silver powder with an average grain size of 1μm or less coated with an organic substance on its surface are used together as the silver powder. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005251542(A) 申请公布日期 2005.09.15
申请号 JP20040059722 申请日期 2004.03.03
申请人 SUMITOMO ELECTRIC IND LTD 发明人 KASUGA TAKASHI;SHIMODA KOHEI;YAMAKAWA SHINKO
分类号 C08K7/06;C08K7/18;C08K9/04;C08K13/06;H01B1/00;H01B1/22;H05K1/09;(IPC1-7):H01B1/22 主分类号 C08K7/06
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