发明名称 Polyimid-Metallfolie Leiterplatte für Hochfrequenzanwendungen
摘要 <p>A metal foil-based layered product which can eliminate the problems caused by etchant infiltration, can be produced easily, and is sufficiently effective in reducing the permittivity of the whole insulating layer; and a process for producing the same. The process for producing the metal foil-based layered product includes the steps of: forming on a metal foil an undercoat film layer made of a poly(amic acid) which has been imidized at least partly; forming a porous, precursor layer on the undercoat film layer by a wet film-forming method using a solution containing a poly(amic acid); and imidizing at least the porous precursor layer.</p>
申请公布号 DE60301213(D1) 申请公布日期 2005.09.15
申请号 DE2003601213 申请日期 2003.01.07
申请人 NITTO DENKO CORP., IBARAKI 发明人 KAWASHIMA, TOSHIYUKI;TAHARA, NOBUHARU;IKEDA, KENICHI
分类号 B05D1/36;B32B15/08;H01B3/30;H05K1/02;H05K1/03;(IPC1-7):B32B15/08;B32B5/18 主分类号 B05D1/36
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