发明名称 |
Polyimid-Metallfolie Leiterplatte für Hochfrequenzanwendungen |
摘要 |
<p>A metal foil-based layered product which can eliminate the problems caused by etchant infiltration, can be produced easily, and is sufficiently effective in reducing the permittivity of the whole insulating layer; and a process for producing the same. The process for producing the metal foil-based layered product includes the steps of: forming on a metal foil an undercoat film layer made of a poly(amic acid) which has been imidized at least partly; forming a porous, precursor layer on the undercoat film layer by a wet film-forming method using a solution containing a poly(amic acid); and imidizing at least the porous precursor layer.</p> |
申请公布号 |
DE60301213(D1) |
申请公布日期 |
2005.09.15 |
申请号 |
DE2003601213 |
申请日期 |
2003.01.07 |
申请人 |
NITTO DENKO CORP., IBARAKI |
发明人 |
KAWASHIMA, TOSHIYUKI;TAHARA, NOBUHARU;IKEDA, KENICHI |
分类号 |
B05D1/36;B32B15/08;H01B3/30;H05K1/02;H05K1/03;(IPC1-7):B32B15/08;B32B5/18 |
主分类号 |
B05D1/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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