| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a three-dimensional electronic circuit device, in which high density mounting and electromagnetic shield are realized at the same time. <P>SOLUTION: The three-dimensional electronic circuit device includes a first circuit substrate 20 having a first shielding conductor 130, a second circuit substrate 30 having a second shield conductor 140, and a structure that an electronic component 70 is carried in a recess 50 with a relay substrate 10 having a third shield conductor 120 on an outer periphery, the first circuit substrate 20, the second circuit board 30, and the electronic component 70 of the relay board 10 are connected inside the relay board 10 in a three-dimensional manner, and the first shield conductor 130, the second shielding conductor 140 and the third shielding conductor 120 are connected mutually. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
