| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an integrated circuit module which lessens loss of an input/output signal by improving characteristic impedance attained by reducing the reflection of high frequency signal near leads with the aid of arranging a via hole in the pad section provided in upper and bottom surface of the circuit board. <P>SOLUTION: The integrated circuit module is provided with a circuit board 1 in which various devices are mounted, a clip 11 sandwiching the circuit 1 brought into contact to pads 2a and 2b in the upper surface and the underside of circuit board 1, and a clip lead 10 composed of a lead 12 extending from the clip 11. At least one via hole 3 is provided for connecting electrically with the pads 2a and 2b arranged on the upper surface and the underside of the circuit board 1. The pads 2a and 2b are electrically connected by filling up the via hole 3 with a conductive material. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
