| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a modular component including different circuit blocks in the same module in which the size is reduced while enhancing reliability by solving a problem that reduction in size is hardly caused because of a land for mounting a shielding metal cap. <P>SOLUTION: The modular component comprises a circuit board 1 on which a plurality of different circuit blocks are formed, an electronic component 6 mounted on each circuit block of the circuit board 1, a sealing body 7 covering the electronic component 6 integrally with resin for each circuit, and a shield electrode 8 formed on the outer surface of the sealing body 7. Since the shield electrode 8 is connected with a ground electrode 4 formed on the circuit board 1 through conductive resin 9, electrical shielding can be attained through a small connection area with the ground electrode 4 and thereby the size can be reduced. Furthermore, the strength of the circuit board 1 is not lowered because the machining of the circuit board 1 is not required at all. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
