| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat transfer device provided with excellent thermal conductivity and excellent heat resistance. SOLUTION: The heat transfer device comprises a heat receiving member 4 attached to a heat source 3, and a heat transfer member 5 interposed between the heat source 3 and the heat receiving member 4. The heat transfer member 5 is made of an amorphous alloy with vitrification temperature lower than the temperature of the heat source 3 at its operating state. The amorphous alloy has a crystallization temperature higher than the temperature of the heat source 3 at its operating state. The heat transfer member 5 comprises the amorphous alloy itself. The heat receiving member 4 is freely removable from the heat source 3 in an inoperative state of the heat source 3 because of solidification of the amorphous alloy, and is closely adhered to the heat source 3 via the heat transfer member 5 in the operating state of the heat source 3 because of vitrification and softening of the amorphous alloy. The heat transfer member 5 may be formed of a crystallized metal after the amorphous metal once exceeds the vitrification temperature. The heat source 3 is a power device. COPYRIGHT: (C)2005,JPO&NCIPI
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