摘要 |
PROBLEM TO BE SOLVED: To obtain a resin or a resin composition which can provide a molded product with good dielectric characteristics at an early stage and within a high-frequency region of at least 1MHz, especially at least 1GHz when it is left under a high temperature, and particularly with little change in dielectric loss tangent. SOLUTION: The resin or the resin composition comprises a vinylbenzyl compound represented by formula (1) compounded with triethylenediamine and/or hexamethylenetetramine and a polymerization inhibitor. In the formula, R<SP>1</SP>is a 2-20C divalent organic group, (R<SP>2</SP>)s may be same or different, and are each a halogen atom, a 1-5C alkyl group, an alkoxy group, a thioalkoxy group, or an aryl group, (x) is an integer of 0-4, and (m) is an integer of 0-20. COPYRIGHT: (C)2005,JPO&NCIPI
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