发明名称 RESIN OR RESIN COMPOSITION (1) FOR MOLDED PRODUCT
摘要 PROBLEM TO BE SOLVED: To obtain a resin or a resin composition which can provide a molded product with good dielectric characteristics at an early stage and within a high-frequency region of at least 1MHz, especially at least 1GHz when it is left under a high temperature, and particularly with little change in dielectric loss tangent. SOLUTION: The resin or the resin composition comprises a vinylbenzyl compound represented by formula (1) compounded with triethylenediamine and/or hexamethylenetetramine and a polymerization inhibitor. In the formula, R<SP>1</SP>is a 2-20C divalent organic group, (R<SP>2</SP>)s may be same or different, and are each a halogen atom, a 1-5C alkyl group, an alkoxy group, a thioalkoxy group, or an aryl group, (x) is an integer of 0-4, and (m) is an integer of 0-20. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005248101(A) 申请公布日期 2005.09.15
申请号 JP20040063625 申请日期 2004.03.08
申请人 SHOWA HIGHPOLYMER CO LTD;TDK CORP 发明人 YOSHIDA HARUO;NISHIGUCHI SHOJI;KOBUNE HIROTAKA;UCHIYAMA RYOTA
分类号 C08F2/40;C08F12/34;(IPC1-7):C08F12/34 主分类号 C08F2/40
代理机构 代理人
主权项
地址
您可能感兴趣的专利