发明名称 |
Heat dissipation device with heat pipes |
摘要 |
A heat dissipation device with heat pipes is described. The heat dissipation device has at least one L-shaped heat pipe, a plurality of heat fins, and a heat sink base. One end of the L-shaped heat pipe is coupled to one heat pipe fixing trench of the heat sink base so as to increase a contact area for transmitting heat and therefore improve a heat dissipation efficiency thereof. The heat fins includes at least one upper heat fin and at least one lower heat fin to couple to the L-shaped heat pipe via a round opening and a long opening respectively. The heat dissipation device therefore reduces a volume thereof and save an occupation space in an electrical device.
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申请公布号 |
US2005201058(A1) |
申请公布日期 |
2005.09.15 |
申请号 |
US20040983609 |
申请日期 |
2004.11.09 |
申请人 |
CHIN HSIANG-JUNG;CHAN HUNG-CHOU;HUANG WEN-LIANG;CHEN CHAO-JUNG |
发明人 |
CHIN HSIANG-JUNG;CHAN HUNG-CHOU;HUANG WEN-LIANG;CHEN CHAO-JUNG |
分类号 |
H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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