| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To increase development efficiency and mass production efficiency of a semiconductor device (LSI) by performing an assembly to form an LSI on a substrate while selecting either one of two mounting modes in response to requirement, without changing the configuration of the LSI, and by realizing a plurality of mounting modes. <P>SOLUTION: The LSI 30 formed with integrated circuits is formed with a plurality of pad parts 40 for connecting the integrated circuits to external circuits. The pad part 40 is formed with connection parts 40A which are composed of windows opened in a protective film 31 and pads 32 exposed from the windows; and connection parts 40B which are composed of windows opened in a protective film 31 and bumps 45 deposited on pads 32 that are exposed from the window. When the LSI 30 is required to connect to external circuits with wire bonding, the connection parts 40A are connected to the external circuits with wires; and when the LSI 30 is required to connect to external circuits with TAB or COG method, the connection parts 40B are directly connected to the external circuits. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
