| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve flatness on the surface of an IC card and its resistibility against bending. <P>SOLUTION: An IC module inlet 4 has an IC chip 2 and an antenna coil 3 connected to the IC chip 2 on a base material 5. One end of the antenna coil 3 is connected to the other end via through-holes 6 and 7 formed on the base material 5, and the thickness of the through-hole A is 3 to 20 μm. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
