发明名称 COOLING STRUCTURE OF ELECTRONIC APPARATUS CASE
摘要 PROBLEM TO BE SOLVED: To ensure dust resistance with an inexpensive structure while effectively cooling a heat generator, even when the heat generator is concentrated on the inside of a case, under the conditions of the case size being decided to be a prescribed value. SOLUTION: In an electronic apparatus case 1, the inside case 5 of a closed structure, housing a board 4 mounting heat generators 3 and a cooling wind passage 6 provided with a fan 9 which flows air, unidirectionally along one side face of the inside case 5. Further, generated heat of the heat generators 3 is conducted directly to the cooling wind passage 6. Alternatively, a heat conductive member 10 is provided, which conducts the generated heat of the inside case 5 heated by the generated heat of the heat generators 3 to the cooling wind passage 6. The heat conductive member 10 having flexibility is arranged to be bent so as to spread into the cooling wind passage 6, and radiating area is widened. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005251916(A) 申请公布日期 2005.09.15
申请号 JP20040059060 申请日期 2004.03.03
申请人 MITSUBISHI ELECTRIC CORP 发明人 AOKI HISAMI;KOBAYASHI TAKASHI
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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