发明名称 PRETREATMENT AGENT FOR ELECTROLESS PLATING, PRETREATMENT METHOD, AND ELECTROLESS PLATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a novel pretreatment agent for electroless plating, a pretreatment method, and electroless plating method in which mirror gloss after plating can be obtained because a surface is smooth, a production speed of a pretreatment step can be increased, and metal ions in plating liquid can be efficiently and reliably reduction-deposited. SOLUTION: Pretreatment agent for electroless plating contains polymerisable compound expressed by general formula (1) [in formula, R<SP>1</SP>denotes a hydrogen group or a methyl group, and R<SP>2</SP>denotes group : formula (a) (n is 0-4, and m is 2-6), or general formula (b) (in formula, p is 1-4)], and polymerization initiator. The pretreatment method includes a step of depositing a film on a surface of a material to be plated by coating the pretreatment agent on the work and performing polymerization, and a step of treating the surface of the film with an alkaline solution. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005248205(A) 申请公布日期 2005.09.15
申请号 JP20040056590 申请日期 2004.03.01
申请人 OMURA TORYO KK 发明人 RENBUTSU EIKO;OMURA YOSHIHIKO
分类号 C23C18/28;C23C18/32;(IPC1-7):C23C18/28 主分类号 C23C18/28
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