| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition which exhibits good adhesion to an Ni-Pd lead frame and good low-stress properties and to provide a semiconductor device excellent in reliability such as solder crack resistance by using the resin composition as a die attach material for a semiconductor. SOLUTION: The resin composition essentially consists of a urethane acrylate obtained by reacting a (meth)acrylic ester compound having an alcoholic hydroxyl group in the molecule with a hydroxyl-terminated compound comprising repeating units represented by formula (1) and isophorone diisocyanate, a reactive diluent having a (meth)acryl group, a bismaleimide compound, a normally liquid epoxy compound, an imidazole derivative represented by formula (2), an organic peroxide, and a filler and is free from a photopolymerization initiator. In formula (1), R is a 3 to 6C hydrocarbon group; and (n) is an integer of 2 to 50. In formula (2), R<SB>1</SB>is a 1 to 20C hydrocarbon group, and R<SB>2</SB>and R<SB>3</SB>are each hydrogen or methyl group. COPYRIGHT: (C)2005,JPO&NCIPI
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