| 摘要 |
The semiconductor device includes the following: a semiconductor chip, in which an integrated circuit is formed, having a polygon surface, and a plurality of electrodes thereon, that is electrically connected to the integrated circuit, is installed on the polygon surface; a first resin layer formed over the polygon surface of the semiconductor chip; a wiring that includes a first part and a second part that are located on the first resin layer; an external terminal installed on the first part of the wiring; and a second resin layer formed over each of the first resin layers so as to cover the second part of the wiring. The plurality of electrodes is disposed along remaining second sides, excluding at least one of the first sides of the polygon surface, and the second resin layer is formed to avoid the area between a side edge located on the side of the first side of the first resin layer and the first side.
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