Heat dissipation device with heat pipes

摘要

A heat dissipation device with heat pipes is described. The heat dissipation device includes at least one U-shaped heat pipe, a plurality of heat fins, and a heat sink base. A middle portion of the U-shaped heat pipe is coupled to the heat sink base to receive thermal energy and transmit the same to two arm portions of the U-shaped heat pipe so as to improve the heat dissipation efficiency. A fixing plate is further utilized to fix the U-shaped heat pipe onto the heat sink base. The fixing plate further absorbs the thermal energy and the thermal energy is transmitted from the middle portion of the U-shaped heat pipe to the two arm portions of the U-shaped heat pipe and then to the heat fins. Therefore, the heat dissipation device can increase the heat dissipation efficiency while reducing the space it occupies in an electrical device.