PREPREG, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD USING SAME

摘要

Disclosed is a prepreg which is obtained by impregnating a thin fiber base with a highly flexible resin which is excellent in heat resistance and adhesion to a metal foil or a fiber base. This prepreg enables to obtain a printed circuit board which has excellent dimensional stability and heat resistance and is foldable to be contained in a casing of an electronic device with high density. Also disclosed are a metal-clad laminate and printed circuit board using such a prepreg. Specifically, the prepreg is obtained by impregnating a fiber base having a thickness of 5-50 mum with a resin composition containing a resin having imide structure and a thermosetting resin.