HEAT-RESISTANT RESIN LAMINATED FILM, MULTILAYER FILM WITH METAL LAYER INCLUDING SAME, AND SEMICONDUCTOR DEVICE

摘要

Disclosed is a heat-resistant resin laminated film free from warp wherein a heat-resistant resin layer is overlaid on a heat-resistant insulating film such as a polyimide film. Also disclosed is a multilayer film with a metal layer which is free from warp after formation of a wiring pattern. The multilayer film with a metal layer is obtained by putting a heat-resistant insulating film and a metal foil together via a heat-resistant resin layer. The heat-resistant resin laminated film comprises a heat-resistant resin layer overlaid at least one side of a heat-resistant insulating film, and the linear expansion coefficient kA (ppm/˚C) of the heat-resistant resin layer is within the range of k-10 <= kA <= k+20 (k: linear expansion coefficient of the heat-resistant insulating film). The multilayer film with a metal layer is obtained by overlaying a metal foil on the heat-resistant resin film side of such a heat-resistant resin laminated film.