| 摘要 |
<P>PROBLEM TO BE SOLVED: To remarkably increase the number of I/O pads more than before as to a semiconductor circuit device constituted by forming an internal circuit in the center and arranging the pads for external connection at a peripheral edge. <P>SOLUTION: A plurality of belts each composed of an array of pads 122a, 122b, and 122c are arrayed so as to extend along the peripheral edge 13, a plurality of pads are formed in different wiring layers at each belt, and a plurality of the belts comprising I/O circuits 121a, 121b, and 121c extending inside the pads are provided. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
