SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a structure and a manufacturing method capable of resolving inconvenience on a structure and a manufacturing process in connection between an optical element and an optical fiber (optical waveguide), and of effectively achieving optical coupling between an optical element and an optical fiber or an optical waveguide.

SOLUTION: An optical element chip 1 is mounted on a mounting substrate 4 with its face directed downward on which a light emitter 2 is formed. An underfill resin 6 is filled between the optical element chip 1 and the mounting substrate 4 to protect the light emitter 2. Light emitted from the light emitter 2 of the optical element chip 1 advances upward and reaches an optical fiber 8 passing through a groove 7 of an opening for entrance/exit of light. The optical element chip 1 and the optical fiber 8 undergo matching of optical axes thereof such that light emanating from the light emitter 2 of the optical element chip 1 is effectively incident on a core 9 of the optical fiber 8. A resin 10 is filled between the optical element chip 1 and the optical fiber 8 for preventing the optical axes from being displaced.

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