| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To eliminate the need for metallizing of a conductor layer on the cavity side or a process of forming a castellation structure, and to form a conductor layer on the cavity side of a multilayer ceramic board and the board side. <P>SOLUTION: The ceramic board comprises a first ceramic board layer 6, a second ceramic board layer 7 laminated on the first ceramic board layer to form a cavity, and a third ceramic board layer 9 laminated on the second ceramic board layer 7 to form a cavity communicating with the cavity of the second ceramic board. The third layer 9 has projecting pieces 25, bent along the cavity side of the second board layer 7 on a part of the layer, and a surface conductor layer 10 is formed on the pieces 25. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
