| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip, on which the alignment of the lens for a laser diode can be performed easily. SOLUTION: In a device forming process at a wafer level, standing structures (120, 430) enclosing the emission areas of a plurality of VCSELs (Vertical Cavity Surface-Emitting Laser) (110, 410) are formed. The standing structure (120) is formed to hold a ball lens (230) or other optical elements for each VCSEL (110), that is, includes a platform on which the optical elements are formed. The ball lens (230), which is mounted on the standing structure (120) in a chip level process or in the wafer level process, is fitted to the standing structure, and is aligned automatically. In forming the optical elements in the wafer level process, the optical elements are aligned with precision related to a lithography process. COPYRIGHT: (C)2005,JPO&NCIPI
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