发明名称 RESIN OR RESIN COMPOSITION FOR MOLDED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a resin or a resin composition which gives a molded product having good initial dielectric properties and hardly undergoes changes in dielectric properties, particularly a dielectric dissipation factor in a high frequency zone of at least 1 MHz, particularly at least 1 GHz when left at a high temperature. SOLUTION: The resin or the resin composition comprises a vinylbenzyl compound represented by general formula (1) (wherein R<SP>1</SP>is a methyl or ethyl group; R<SP>2</SP>is a hydrogen atom or a 1-10C hydrocarbon group; and n is an integer of 2-6) and, incorporated therewith, triethylenediamine and/or hexamethylenetetramine, where phenothiazine is added at the time of the manufacture or after the manufacture of the vinylbenzyl compound. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005248102(A) 申请公布日期 2005.09.15
申请号 JP20040063626 申请日期 2004.03.08
申请人 SHOWA HIGHPOLYMER CO LTD;TDK CORP 发明人 YOSHIDA HARUO;NISHIGUCHI SHOJI;KOBUNE HIROTAKA;UCHIYAMA RYOTA
分类号 C08L101/00;C08K5/06;C08K5/17;C08K5/3477;C08K5/46;(IPC1-7):C08L101/00;C08K5/347 主分类号 C08L101/00
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