发明名称 Process for preparing a non-conductive substrate for electroplating
摘要 A composition and process for electroplating a conductive metal layer onto the surface of a non-conductive material is disclosed. The composition and process utilizes an obvious dispersion traditional carbon black particles and highly conductive carbon black particles. The mixture of carbon blacks provides optimum dispersion and electroplating properties.
申请公布号 US2005199504(A1) 申请公布日期 2005.09.15
申请号 US20040798522 申请日期 2004.03.11
申请人 LEE HYUNJUNG 发明人 LEE HYUNJUNG
分类号 C25D5/02;C25D5/54;H05K3/42;(IPC1-7):C25D5/02 主分类号 C25D5/02
代理机构 代理人
主权项
地址