发明名称 |
Process for preparing a non-conductive substrate for electroplating |
摘要 |
A composition and process for electroplating a conductive metal layer onto the surface of a non-conductive material is disclosed. The composition and process utilizes an obvious dispersion traditional carbon black particles and highly conductive carbon black particles. The mixture of carbon blacks provides optimum dispersion and electroplating properties.
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申请公布号 |
US2005199504(A1) |
申请公布日期 |
2005.09.15 |
申请号 |
US20040798522 |
申请日期 |
2004.03.11 |
申请人 |
LEE HYUNJUNG |
发明人 |
LEE HYUNJUNG |
分类号 |
C25D5/02;C25D5/54;H05K3/42;(IPC1-7):C25D5/02 |
主分类号 |
C25D5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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