| 摘要 |
<P>PROBLEM TO BE SOLVED: To mount certainly electronic parts to a substrate by recognizing more precisely positions and the displacement of electronic parts held by an adsorption nozzle, in an electronic part mounting device. <P>SOLUTION: The electronic part mounting device (1) for mounting the electronic parts to a substrate (P) holds the electronic parts (D) at the tip of an adsorption nozzle (6a) provided toward a lower part from a loading head (6). The electronic part mounting device is provided with a first image pick-up section that images the electronic parts held in the tip of an adsorption nozzle from a lower part (for example, a first CCD camera 8b), a reference mark (8a) arranged at the first image pick-up side section, and a second image pick-up section with which a loading head is equipped and that images the reference mark from the upper part (for example, a second CCD camera 6b). A reference mark recognition means (control unit 10) recognizes the positions of the electronic parts which the first image pick-up section images in association with the position of the reference mark which the second image pick-up section images. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
