发明名称 FLAME RETARDANT ADHESIVE COMPOSITION, AND COVER LAY FILM AND FLEXIBLE COPPER CLAD LAMINATE PLATE BY USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an adhesive composition of which cured material obtained by curing is excellent in flame retardant property and electric characteristics (migration resistance) and without containing a halogen, and a cover lay film and flexible copper clad laminate plate by using the same. SOLUTION: This flame retardant adhesive composition contains (A) a non-halogen-based epoxy resin, (B) a thermoplastic resin and/or synthetic rubber, (C) a curing agent, (D) a curing accelerator, (E) a phosphorus-containing plasticizer and (F) an inorganic filler. The cover lay film and flexible copper clad laminate plate by using the same are also provided. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005248134(A) 申请公布日期 2005.09.15
申请号 JP20040064722 申请日期 2004.03.08
申请人 SHIN ETSU CHEM CO LTD 发明人 NAKANISHI NOBORU;AIZAWA MICHIO;AMANO TADASHI
分类号 B32B15/08;B32B15/088;C09J11/00;C09J109/02;C09J121/00;C09J133/00;C09J163/00;C09J167/00;C09J179/08;H05K1/03;(IPC1-7):C09J163/00 主分类号 B32B15/08
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