THIN FILM MAGNETIC HEAD, WAFER OF THIN FILM MAGNETIC HEAD, HEAD GIMBAL ASSEMBLY, HARD DISK DEVICE, AND MANUFACTURING METHOD OF THIN FILM MAGNETIC HEAD

摘要

PROBLEM TO BE SOLVED: To suppress occurrence of a side lobe and increase of series resistance of a lead layer in a CIP type MR element. SOLUTION: The thin film magnetic head has an MR element 2, a pair of bias layers 6 giving a bias magnetic field to the MR element 2, and a pair of lead layers 7 extending by covering at least one part of each of the bias layer 6 and supplying a sense current to the MR element 2. The bias layer 6 is extended with an almost symmetrically at both sides of the MR element 2 in the direction of track width of the recording medium. In a junction part to the MR element 2, the layer 6 is joined in the direction vertical to a medium facing plane in which the MR element 2 is opposite to the recording medium with approximately same length as the MR element 2, and the layer 6 has such a shape that it is included in the inside of a virtual rectangle in which a track width direction of the recording medium along the medium facing plane is made a long side and the direction being vertical to the medium facing plane is made a short side, and one part is brought into contact with a side being opposite to a side in contact with the MR element 2 of the virtual rectangle. COPYRIGHT: (C)2005,JPO&NCIPI