| 发明名称 |
Electroplating composite substrates |
| 摘要 |
An electrolyte employed to selectively deposit a tin or tin alloy film on a composite substrate. A method for depositing the tin or tin alloy on the composite substrate also is described.
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| 申请公布号 |
US2005199506(A1) |
申请公布日期 |
2005.09.15 |
| 申请号 |
US20040913936 |
申请日期 |
2004.08.06 |
| 申请人 |
ROHM AND HAAS ELECTRONICS MATERIALS, L.L.C. |
发明人 |
TOBEN MICHAEL P.;BROWN NEIL D.;CHIRAFISI ANGELO |
| 分类号 |
C25D3/30;C25D3/32;C25D3/60;H05K1/03;H05K3/24;(IPC1-7):C25D3/32 |
主分类号 |
C25D3/30 |
| 代理机构 |
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