| 摘要 |
A light-emitting device with high heat-dissipating efficiency, includes a ceramic substrate having at least one pair of power-supply circuits mounted at a specific location of the substrate, a light-emitting die fixedly mounted on the ceramic substrate by flip-chip mounting, wherein the two electrodes of the light-emitting die are electrically connected to a corresponding power-supply circuit, respectively, and an optical reflector which is adjacently mounted in the periphery of the light-emitting die and made up of a metallic material or a material with a high coefficient of thermal conductivity for increasing the heat-dissipating area and providing a light-guiding mechanism.
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