IMPROVED METHOD FOR MICRO-ROUGHENING TREATMENT OF COPPER AND MIXED-METAL CIRCUITRY
摘要
Process to improve adhesion of dielectric materials to a metal layer, including providing an unpatterned metal layer having a first major surface; micro-roughening the first major surface to form a micro-roughened surface; and etching the metal layer to form a circuit pattern in the metal layer, in which the micro-roughening is carried out prior to the etching.
申请公布号
WO2005034596(B1)
申请公布日期
2005.09.15
申请号
WO2004US31697
申请日期
2004.09.27
申请人
ATOTECH DEUTSCHLAND GMBH;FUERHAUPTER, HARRY;BARON, DAVID, THOMAS;JOHAL, KULDIP, SINGH;BROOKS, PATRICK, PAUL
发明人
FUERHAUPTER, HARRY;BARON, DAVID, THOMAS;JOHAL, KULDIP, SINGH;BROOKS, PATRICK, PAUL