Device for mounting semiconductor chips on a substrate especially a metallic lead-frame has a sensor for detecting a first longitudinal edge of the substrate enabling accurate chip positioning across the substrate

摘要

Device mounts chips on a substrate, especially a metallic lead-frame (1) with the substrate moved in steps in a first direction (x), while a sensor (12) determines the position of an edge (4) of the substrate in a second direction (y). The sensor comprises light source and two adjacent light paths with one acting as a reference.