| 摘要 |
<p>The present invention aims to provide a technique in which a layer to be transferred is easily peeled and transferred to a transferred body that has pliability or flexibility. Also, the present invention aims to provide a method of fabricating a semiconductor device using these peeling and transfer techniques, and electronic equipment fabricated with the semiconductor device. In order to solve the above-mentioned problems, a transfer method in which a layer to be transferred formed on a substrate is transferred to a transfer body that has pliability or flexibility includes the first step of forming a layer to be transferred on a substrate; the second step of bonding the layer to be transferred formed on the substrate to a transfer body having pliability or flexibility fixed on a fixture; and the third step of peeling the layer to be transferred from the substrate and transferring the layer to be transferred to the transfer body. <IMAGE> <IMAGE> <IMAGE> <IMAGE> <IMAGE> <IMAGE> <IMAGE> <IMAGE></p> |
