| 摘要 |
A method of processing diamond in the manufacture of semiconductors comprises mounting the diamond on a carrier, applying semiconductor processing to the diamond, and then separating the processed diamond from the carrier. The method is character-ised in that the diamond is attached to the carrier by direct bonding. The direct bonding typically comprises forming a flat polished surface on the diamond and a corresponding flat polished surface on the carrier, bringing the surfaces into intimate contact, and annealing the diamond and carrier at an elevated temperature. |
