| 摘要 |
A first spring 54 is provided between a support member 51 driven in the Z-axis direction and a heat block 53, and biases the support member 51 and the heat block 53 in the direction of separating them from each other. A second spring 57 is provided between a first pusher 55 for pressing a die 81 of an IC device 8 and a second pusher 56 for pressing a substrate 82 of the IC device 8, and biases the first pusher 55 and the second pusher 56 in the direction of separating them from each other. <??>According to an electronic device handling apparatus having the above configuration, it is possible to respond to changes of kinds of electronic devices, improve surface conformance and uniformly press an electronic device with an accurate load. <IMAGE>
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