| 摘要 |
A wire saw ( 10 ) for simultaneously slicing multiple, generally cylindrical monocrystalline ingots ( 14 ) into wafers. The wire saw includes a cutting head ( 16 ), an ingot support ( 12 ), and multiple generally parallel lengths of cutting wire ( 18 ) defining a cutting web ( 30 ). A slurry delivery system includes nozzles ( 34, 36 , and 38 ) positioned for dispensing slurry along the wire web generally at lateral sides of each ingot. A process for simultaneously slicing at least two generally cylindrical semiconductor ingots into wafers includes mounting at least two ingots to a common ingot support, moving the ingot support relative to the cutting web so that the two ingots simultaneously press against the cutting web at cutting regions, and dispensing a liquid slurry to at least three locations on the wire web including two outermost sides of the cutting regions and a location between each pair of ingots.
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