发明名称 |
Method and apparatus for detecting backside contamination during fabrication of a semiconductor wafer |
摘要 |
A method of detecting contamination on a backside of a semiconductor wafer includes the steps of positioning the backside of the wafer in contact with a detection surface of a contaminant sensor, and detecting deformation of the detection surface of the contaminant sensor. The contaminant sensor may be incorporated into a fabrication device such as a wafer handling device, or can be utilized in the construction of a stand-alone device. An apparatus for detecting contamination on the backside of a semiconductor wafer is also disclosed.
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申请公布号 |
US6943055(B2) |
申请公布日期 |
2005.09.13 |
申请号 |
US20030628601 |
申请日期 |
2003.07.28 |
申请人 |
LSI LOGIC CORPORATION |
发明人 |
BERMAN MICHAEL J.;BAILEY GEORGE E.;BARBER RENNIE G. |
分类号 |
H01L21/00;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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