SEMICONDUCTOR DEVICE, THREE-DIMENSIONAL MOUNTING SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

Stacked semiconductor devices constitute a three-dimensional mounting semiconductor apparatus. Such a semiconductor device comprise a silicon semiconductor substrate on a major surface of which an integrated circuit part and an electrode pad are provided. A hole is made in the silicon semiconductor substrate by etching using the electrode pad as an etching stopper layer. A buried electrode is provided in this hole and used for electrical connection of the electrode pad to the back major surface of the silicon semiconductor substrate.