发明名称 |
Multichip module package and fabrication method |
摘要 |
A method for fabricating a multichip module package includes providing a first heat sink positioned for releasing heat from the package and providing a second heat sink positioned proximate the first heat sink. The heat sinks are thermally coupled and electrically isolated to and from one another. A first semiconductor device is attached to the first heat sink in thermal and electrical communication therewith and electrically insulated from the second heat sink. A second semiconductor device is attached to the second heat sink in thermal and electrical communication therewith and electrically insulated from the first heat sink.
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申请公布号 |
US6943057(B1) |
申请公布日期 |
2005.09.13 |
申请号 |
US20040931654 |
申请日期 |
2004.08.31 |
申请人 |
STATS CHIPPAC LTD. |
发明人 |
SHIM IL KWON;FILOTEO, JR. DARIO S.;HO TSZ YIN;SOON SEBASTIAN T. M. |
分类号 |
H01L21/44;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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