发明名称 |
Solder bump transfer sheet, method for producing the same, and methods for fabricating semiconductor device and printed board |
摘要 |
The method for producing a solder bump transfer sheet of the invention includes the steps of: providing a sheet having a chromium oxide layer containing substantially no iron oxide as the outermost surface; and forming a plurality of solder bumps placed in a predetermined pattern on the chromium oxide layer.
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申请公布号 |
US6943102(B2) |
申请公布日期 |
2005.09.13 |
申请号 |
US20030747076 |
申请日期 |
2003.12.30 |
申请人 |
NEOMAX CO., LTD. |
发明人 |
YAMAMOTO MASAHARU |
分类号 |
H01L21/48;H01L21/60;H05K3/34;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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