| 发明名称 |
Substrate treating method and apparatus |
| 摘要 |
A substrate treating method for treating substrates with a treating solution includes a step of heating a treating solution containing sulfuric acid, and treating, with the treating solution, the substrates coated with a film material including a high dielectric-constant material. The substrates with the high dielectric-constant material are treated appropriately by heating, before use, the treating solution containing sulfuric acid.
|
| 申请公布号 |
US6941956(B2) |
申请公布日期 |
2005.09.13 |
| 申请号 |
US20030382611 |
申请日期 |
2003.03.05 |
| 申请人 |
DAINIPPON SCREEN MFG. CO., LTD. |
发明人 |
OSAWA ATSUSHI;TANAKA MASATO;NAGAMI SHUZO |
| 分类号 |
B08B3/08;H01L21/00;H01L21/28;H01L21/311;H01L21/316;(IPC1-7):H01L21/302;H01L21/461;B05C11/02;B05C13/02 |
主分类号 |
B08B3/08 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
