Manufacturing of a corrosion protected interconnect on a substrate

摘要

A method for fabricating an interconnect on a surface of a passivated substrate includes applying a diffusion barrier to the surface of the passivated substrate and applying a mask to the diffusion barrier. The mask is then patterned to provide an opening for the interconnect. The interconnect is deposited in the opening and the mask is removed. Those portions of the diffusion barrier that are not covered by the interconnect are also removed. The interconnect and what is left of the diffusion barrier are then encapsulated by metal-selective wet-chemical dip coating.