发明名称 |
Two-sided chemical mechanical polishing pad for semiconductor processing |
摘要 |
A chemical mechanical polishing (CMP) pad includes a unitary body having a first side and a second side, the first side having a plurality of holes formed therein, and the second side having a plurality of grooves formed therein. Each of the plurality of holes in the first side is aligned with one of the plurality of grooves in the second side.
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申请公布号 |
US6942549(B2) |
申请公布日期 |
2005.09.13 |
申请号 |
US20030605828 |
申请日期 |
2003.10.29 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
KHOURY RAYMOND M. |
分类号 |
B24B37/04;B24D13/14;(IPC1-7):B24B1/00;B24D11/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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