Security tag and system for fabricating a tag

摘要

A method of fabricating a tag includes the steps of applying a first patterned adhesive (122) to the surface (150a) of the substrate and applying a first electrically conductive foil (132) to the first patterned adhesive. A portion of the first electrically conductive foil (132) not adhered to the first patterned adhesive (135) is removed and a second patterned adhesive is applied to a portion of a surface area (132a) of the tag. A preformed second electrically c onductive foil (140) is applied to the second patterned adhesive (135) to adhere the second electrically conductive foil (140) to the surface of the substrate and portions of the first and second electrically conductive foils are electrically coupled to each other to form a tag circuit. A second patterned adhesive (135a)is disposed between the first (132) and second (140) electricallyconductive foils.