Surface mount light emitting diode (LED) packages each contain a light emitting diode (LED) die (24). A plurality of arrays of openings are drilled into an electrically insulating sub-mount wafer (10). A metal is applied to the drilled openings to produce a plurality of via arrays (12). The LED dice (24) are flip-chip bonded onto a frontside (16) of the sub-mount wafer (10). The p-type and n-type contacts of each flip-chip bonded LED (24) electrically communicate with a solderable backside (18) of the sub-mount wafer (10) through a via array (12). A thermal conduction path (10, 12) is provided for thermally conducting heat from the flip-chip bonded LED dice (24) to the solderable backside (18) of the submount wafer (10). Subsequent to the flip-chip bonding, the sub-mount wafer (10) is separated to produce the surface mount LED packages.
申请公布号
WO2004088760(A3)
申请公布日期
2005.09.09
申请号
WO2004US08789
申请日期
2004.03.23
申请人
GELCORE LLC
发明人
CHEN, CHEN-LUN HSING;WEAVER, STANTON, JR.;ELIASHEVICH, IVAN;LIBON, SEBASTIEN;ARIK, MEHMET;SHADDOCK, DAVID