发明名称 |
SEMICONDUCTOR DEVICE |
摘要 |
A semiconductor device, wherein a substrate (51) is formed in a rectangular shape with four sides along dicing lines, and a jetty part (56) is formed to surround all the peripheries of an actuator element (50) and electrode pads (54) and (55) for input/output. The jetty part (56) is formed in a rectangular shape with four sides, and each side thereof is continuously extended parallel with each side of the substrate (51). Since the adhesion of a protective tape (9) can be increased by the jetty part (56), foreign matters (104) produced in dicing can be prevented from adhering to the actuator element (50) and the electrode pads (54) and (55). |
申请公布号 |
WO2005083765(A1) |
申请公布日期 |
2005.09.09 |
申请号 |
WO2005JP03302 |
申请日期 |
2005.02.28 |
申请人 |
TOKYO ELECTRON LIMITED;KAGAWA, KENICHI;YAKABE, MASAMI |
发明人 |
KAGAWA, KENICHI;YAKABE, MASAMI |
分类号 |
B81B3/00;B81C1/00;G01D5/24;G01P15/08;G01P15/125;H01L21/301;H01L29/84 |
主分类号 |
B81B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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