CIRCUIT SUBSTRATE INSPECTION DEVICE AND CIRCUIT SUBSTRATE INSPECTION METHOD

摘要

There is provided a circuit substrate inspection device capable of performing electrical inspection of a circuit substrate with a high reliability even when the circuit substrate to be inspected has small electrodes of a small pitch. The circuit substrate inspection device includes a first inspection jig and a second inspection jig, between which a circuit substrate to be inspected is arranged with a sandwiching pressure for performing electric inspection. As a first anisotropic conductive sheet arranged at the side of the circuit substrate to be inspected for a pitch conversion substrate, there is used an anisotropic conductive sheet having conductive particles arranged in the thickness direction and uniformly dispersed in the surface direction. Moreover, a connection electrode of the pitch conversion substrate is formed by a current terminal electrode and a voltage terminal electrode which are electrically connected to respective inspection electrodes of the circuit substrate to be inspected. On the connector substrate, there are arranged a current pin side electrode and a voltage pin side electrode to be electrically connected respectively to the current terminal electrode and the voltage terminal electrode of the pitch conversion substrate. Moreover, an intermediate holding plate is arranged between a first insulation plate and a second insulation plate in a relay pin unit and between them, support pints are arranged at abutment support positions different from the front and the rear surfaces.