发明名称 METHOD AND APPARATUS FOR MONITORING A PLASMA IN A MATERIAL PROCESSING SYSTEM
摘要 The present invention presents an improved apparatus and method for monitoring a material processing system (100), wherein the material processing system includes a plasma processing tool, a number of RF-responsive sensors (190) coupled to the plasma processing tool to generate and transmit plasma data, and a sensor interface assembly (SIA) (180) configured to receive the plasma data from the plurality of RF-responsive sensors.
申请公布号 KR20050089995(A) 申请公布日期 2005.09.09
申请号 KR20057012305 申请日期 2005.06.29
申请人 TOKYO ELECTRON LIMITED 发明人 KLEKOTKA JAMES E.
分类号 H01J37/32;H01L21/00;(IPC1-7):H01L21/306;H01L21/205 主分类号 H01J37/32
代理机构 代理人
主权项
地址