发明名称 PROBE CARD
摘要 PROBLEM TO BE SOLVED: To provide a probe card capable of disposing a wiring pattern easily without providing a through hole, while using a silicon substrate as the support substrate. SOLUTION: This probe card is equipped with a pyramid-shaped support substrate 100 having one step on one surface, a plurality of probes 200 provided on the surface of a thick part of the support substrate 100, a plurality of bumps 110 provided on the surface of a thin part of the support substrate 100, and a plurality of wiring patterns 120 formed on one surface of the support substrate 100, for connecting electrically the probes 200 to the bumps 110 respectively. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005241275(A) 申请公布日期 2005.09.08
申请号 JP20040047657 申请日期 2004.02.24
申请人 JAPAN ELECTRONIC MATERIALS CORP 发明人 KIMURA TEPPEI
分类号 G01R1/067;G01R1/073;G01R31/02;H01L21/66;(IPC1-7):G01R1/073 主分类号 G01R1/067
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