COMPONENT MOUNTING INSPECTION METHOD AND CIRCUIT BOARD INSPECTION APPARATUS

摘要

PROBLEM TO BE SOLVED: To inspect the quality of circuit components without using mechanical contacts while reducing manufacturing costs of a circuit board inspection apparatus. SOLUTION: A spring-type probe (probe pin 3a) for electric measurement is moved in such a way that a tip part may be moved between a location D0 at a longer distance from a substrate surface of a circuit board B than the distance Lp0 from the substrate surface to the upper surface of a circuit component P at mounting locations to which the circuit component P to be inspected is to be mounted and a location D (n+3) closer to the substrate surface than the location Lp0 is at the mounting locations. Electric parameters between the probe pin 3a and an electrode 2b between both locations are intermittently and continuously measured. The quality of mounting of the circuit component P is inspected on the basis of either the distance from the probe pin 3a to the substrate surface when the measurement values reaches constant values or approximately constant values or the time from the time of the start of the movement of the probe for electric measurement to the time when the measurement values reaches constant values or approximately constant values. COPYRIGHT: (C)2005,JPO&NCIPI